Multi-purpose PC Resin Particles Raw Material with Good Thermal Conductivity
Dongguan Forever Co.,Ltd is the manufacture of the China origin cheap UV stablized PC polycarbonate Granules Polymer Resin
The specific heat capacity of 399 X 91042-XH Generally refers to the heat required when the temperature of plastic molded products rises by 1°C. Specific heat capacity is the same as thermal conductivity and is the reference data for studying the temperature rise of target products in product design.
The continuous operating temperature of 399 X 91042-XH reflects the heat resistance of plastic molded products. Generally divided into physical heat resistance and chemical heat resistance. The former refers to the performance of maintaining the shape of the product at a specified heating temperature; the latter represents the thermal stability of molecular bonds in plastic molding materials.
General | ||
Form Resin Pellets | ||
Filler | Thermally Conductive Proprietary Filler | |
Feature | Thermally Conductive(Isolation) | |
Physical Nominal Value Test Method | ||
Density / Specific Gravity 1.58 g/cm³ ASTM D792 | ||
Linear Mold Shrinkage(Thickness; 3.17 mm) 0.1 % ASTM D955 | ||
Mechanical Nominal Value Test Method | ||
Tensile Strength, Break 51.7 MPa ASTM D638 | ||
Elongation at Break 0.40 % ASTM D638 | ||
Tensile Modulus 2.14E+4 MPa ASTM D638 | ||
Flexural Strength 68.9 MPa ASTM D790 | ||
Flexural Modulus 1.52E+4 MPa ASTM D790 | ||
Izod Impact, Notched(Thickness; 3.17 mm) 21.4 J/m ASTM D256 | ||
Izod Impact, Unnotched(Thickness; 3.17 mm;80x10x3 mm) | 80.1 J/m ASTM D4812 | |
Thermal Nominal Value Test Method | ||
CTE, Flow 15.7 µm/m-°C ASTM E831 | ||
CLTE, Transverse 51.7 µm/m-°C ASTM E831 | ||
Thermal conductivity through plane(through-plane) 1.00 W/m-K ASTM E1530 | ||
Thermal conductivity in plane(in-plane) 5.04 W/m-K ASTM E1530 | ||
Deflection Temperature(Pressure; 1.8 MPa) 116 °C ASTM D648 | ||
Flammability, UL94(Thickness; 1.59 mm) V-0 UL 94 | ||
Electrical Nominal Value Test Method | ||
Volume Resistivity > = 1.00e+12 ohms ·cm ASTM D257 | ||
Dielectric Constant(Frequency; 1.0e+6 Hz) 3.0 | ||
Dissipation Factor(Frequency; 1.0e+6 Hz) 0.0030 | ||
Processing | Nominal Value |
Melt Temperature | 288 - 316 °C |
Mold Temperature | 82.2 - 121 °C |
Drying Temperature | 121 °C |
Dry Time | 4 hour |
Moisture Content | 0.020 % |
Dew Point | -28.9 °C |
Injection Pressure | 68.9 - 103 MPa |
