Thermal Conductive Plastics Raw Materials Polycarbonate PC Price for Led Grow Light

Dongguan Forever Co.,Ltd is the manufacture of the China origin cheap UV stablized PC polycarbonate Granules Polymer Resin

The specific heat capacity of PC 300 TC-I-15-XH Generally refers to the heat required when the temperature of plastic molded products rises by 1°C. Specific heat capacity is the same as thermal conductivity and is the reference data for studying the temperature rise of target products in product design.

The continuous operating temperature of 300 TC-I-15-XH reflects the heat resistance of plastic molded products. Generally divided into physical heat resistance and chemical heat resistance. The former refers to the performance of maintaining the shape of the product at a specified heating temperature; the latter represents the thermal stability of molecular bonds in plastic molding materials.

General

Form                                        Resin Pellets

Feature

Thermally

  Conductive(Isolation)

Physical

Nominal Value

Test Method

Density / Specific Gravity

2.45 g/cm³

ASTM D792

Mechanical

Nominal Value

Test Method

Tensile Strength, Break

34.5 MPa

ASTM D638

Elongation at Break

< = 1.0 %

ASTM D638

Tensile Modulus

1.03E+4 MPa

ASTM D638

Flexural Strength

55.2 MPa

ASTM D790

Flexural Modulus

1.03E+4 MPa

ASTM D790

Izod Impact, Notched(Thickness; 3.2 mm)

26.7 J/m

ASTM D256

Izod Impact, Unnotched(Thickness; 3.2 mm)

80.1 J/m

ASTM D4812

Thermal

Nominal Value

Test Method

Thermal conductivity through plane(through-plane)

0.751 W/m-K

ASTM E1530

Deflection Temperature(Pressure; 1.8 MPa)

116 °C

ASTM D648

Electrical

Nominal Value

Test Method

Surface Resistivity per Square

> = 1.00e+12 Ohms

ASTM D257

Processing


Nominal Value

Melt Temperature


288 - 316 °C

Mold Temperature


82.2 - 121 °C

Drying Temperature(Time 4 hr)


121 °C

Moisture Content


0.020 %

Dew Point


-28.9 °C

Injection Pressure


68.9 - 103 MPa



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