Factory Price Thermal Conductivity PC Resin for Electric And Electronic Industry

Dongguan Forever Co.,Ltd is the manufacture of the China origin cheap UV stablized PC polycarbonate Granules Polymer Resin

The specific heat capacity of PC 50-8779-XH Generally refers to the heat required when the temperature of plastic molded products rises by 1°C. Specific heat capacity is the same as thermal conductivity and is the reference data for studying the temperature rise of target products in product design.

The continuous operating temperature of 50-8779-XH reflects the heat resistance of plastic molded products. Generally divided into physical heat resistance and chemical heat resistance. The former refers to the performance of maintaining the shape of the product at a specified heating temperature; the latter represents the thermal stability of molecular bonds in plastic molding materials.

General

Form                                        Resin Pellets

Feature

Thermally

 Conductive(Isolation)

Physical

Nominal Value

Test Method

Density / Specific Gravity

1.39 g/cm³

ISO 1183

Linear Mold Shrinkage

0.4 - 0.7 %


Mechanical

Nominal Value

Test Method

Tensile Strength

41.0 MPa


Elongation at Break

0.700 %


Modulus of Elasticity

10000 MPa


Flexural Strength(Strain 1 %)

62.0 MPa


Flexural Modulus

8500 MPa


C harpy Impact Unnotched(23 °C)

7 kJ/m²

ISO 179 1eU

Thermal

Nominal Value

Test Method

Thermal Conductivity, In Plane(Hot Disk;Parallel 60x60x3 17.0 W/m-K

mm)

Maximum Service Temperature, Air



Continuous

130 °C


Short Term

150 °C


Electrical

Nominal Value

Test Method

Volume Resistivity(10V)

< = 10000 ohms ·cm


Surface Resistance(10 V)

< = 1000 Ohms




Processing

Nominal Value

Nozzle Temperature

290 - 310 °C

Zone 1

280 - 300 °C

Barrel - Zone 2 Temperature

290 - 310 °C

Barrel - Zone 3 Temperature

300 - 320 °C

Melt Temperature

295 °C

Mold Temperature

80.0 - 120 °C

Drying Temperature(Time 4 - 6 hr)

120 °C



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